How to process high quality micro hole efficiently

29 June 2021

Semiconductor ceramics Ceramics with semiconductor properties and electrical conductivity of about 10-6 ~ 105S/m. The conductivity of semiconductor ceramics due to the external conditions (temperature, light, electric field, atmosphere and temperature, etc.) changes and significant changes, so you can change the physical quantity of the external environment into electrical signals, made of various uses of sensitive components. In recent years, with the development of 5G, materials such as single crystal silicon and ceramics have been more and more widely used in the field of semiconductors. The machined parts are developing towards precision and miniaturization, and the processing of precision micro holes has attracted more and more attention. It is generally believed that machining mechanical keyhole is difficult at home and abroad. As a common micro structure, micro hole is widely used in various parts, such as mobile phone, computer and other industries in the manufacturing of micro hole processing is a major difficulty. How to process high quality micro hole efficiently? Xiazhi technology latest research and development product PCD micro drill, the product has high hardness, high wear-resisting characteristics. The ideal drilling speed and life are obtained in the processing process, which meets the processing needs of small holes and fine deep holes.

pcd and pcbn cutting tools

 

 

 

Application

Suitable for monocrystalline silicon and quartz Ceramics, etc. are fragile and difficult to process Material drilling.

 

Advantage

φ0.1mm~φ2.0mm Any size according to customer needs;

Can be customized Fast product within 5~10 days Delivery capability;

This product has been large and stable Supply to Japanese and Korean companies.

 pcd and pcbn cutting tools

Specification

Model

Blade Diameter

Balde Length

Total Length

Shank Diameter

X020

0.2

6.0

38

3.175

X030

0.3

6.0

38

3.175

X040

0.4

7.0

38

3.175

X050

0.5

13.5

40

3.175

X060

0.6

13.5

40

3.175

X070

0.7

13.5

40

3.175

X080

0.8

13.5

40

3.175

X090

0.9

13.5

40

3.175

X100

1.0

13.5

40

3.175

Case

Size

 

Processing material

 

Type of cooling

 

processing method

 

finish depth

 

rotate speed

 

feed

 

Q-value

 

D0.2*2L*3.175D*38L

Ceramic

 

oil cooling

 

Deep hole pecking

 

1.5mm

30000r/min

2mm/min

0.005mm

 

 

 

 

 

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