Diamond grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.
Learn More >
Dicing blades are used for cutting silicon wafers, copper wafer, LED Packages, hard and brittle materials.
Learn More >
More Superhard provides polyurethane (PU) polishing pads. Abrasive fillers include cerium and zirconium, some pads do not have abrasive filler.
Learn More >
