More Superhard diamond / CBN grinding disc including resin diamond / CBN grinding disc, vitrified diamond / CBN grinding disc, double-disc surface grinding disc, pellet grinding wheel and so on.
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China International Optoelectronic Exposition (CIOE) was held in shenzheng international convention and exhibition center from September 4 to 7, 2019.More super Hard were invited to attend the exhibit...
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Diamond grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.
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Dicing blades are used for cutting silicon wafers, copper wafer, LED Packages, hard and brittle materials.
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More Superhard provides polyurethane (PU) polishing pads. Abrasive fillers include cerium and zirconium, some pads do not have abrasive filler.
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