PCD Micro Drill is used in the Semiconductor industry, National defense field, Aerospace, Chip&Communication electronics, Automotive, electronics, and High-end medical equipment fields.
The Micro Drilling products cover semiconductor materials, metals, ceramics and polymers. Each product has laser and beam delivery design optimized for a specific application, and can be configured for manual or automatic operation, allowing customers to buy exactly the application solution they need.
PCD MICRO DRILLS FEATURES
▶Improved Tool Life
▶Improved Productivity
▶Improved Hole Quality
▶Reducing Your Machining Time
PCD MICRO DRILLS STANDARD
Highest technology laser manufactured micro PCD drills.
Micro PCD drills are used in the semiconductor industry for monocrystalline applications such as cleaning and inspection jigs.
They are also used for the graphite electrode manufacturing for EDM and drilling very hard to machine materials in the die & mold industry.
Designed with superb surface quality and edge sharpness.
Multiple scale tool life as compared to standard carbide coated micro drills.
Other dimensions are available per request.
| Specification Table | ||||||||
| Series | Specification | d1(mm) | L2(mm) | L2/D | D2 | L | α | Application |
| MSH-CT-D1 | d1*L2*SD3.175*L*α | 0.2-≤0.4 | 2~6 | 32 | 3.175 | 38/45 | 110°-130° | Graphite, polymer wear-resisting material, aluminum alloy, and other non-ferrous metals |
| 0.4-≤0.8 | 4~13.5 | |||||||
| 0.8-≤2.0 | ||||||||
| MSH-CT-D2 | d1*L2*SD3.175*L*α | 0.4-≤0.8 | 4~13.5 | 20 | 3.175 | 38/45 | 110°-130° | Composite ceramic wear-resistant material |
| 0.8-≤2.0 | 3.175 | 38/45 | 110°-130° | |||||
| MSH-CT-D3 | d1*L2*SD3.175*L*α | 0.2-≤0.35 | 2~4 | 38 | 3.175 | 38/45 | 110°-130° | Monocrystalline silicon,polysilicon |
| 0.35-≤0.75 | 2~7 | |||||||
| 7~13.5 | ||||||||
| Non-standard products can be customized! | ||||||||
Monocrystalline Silicon Processing Case 1
Material: monocrystalline silicon
| SIC non-pressure sintering ceramic parameter | ||
| Index | Performance | Unit |
| Volume Density | ＞3.12 | g/cm³ |
| Purity | 98.50% | % |
| Bending strength | ＞400 | Mpa |
| HRC | ＞93 | HBA |
| Thermal conductivity | 148 | W/m*k |
| MOE | 415 | GPa |
| Fracture toughness | ＞4.5 | Mpa.m1/2 |
| Application | Cooling fin, bulletproof plate, mechanical seal sandblasting nozzle | |
ZIRCONIA PROCESSING CASE-Φ0.451
|
Zirconia ceramic parameter
|
||
|
Performance |
Unit |
Data |
|
Density |
g/cm³ |
6 |
|
Mohs hardness |
level |
8.5-9 |
|
Bending strength |
Mpa |
1100 |
|
Compressive strength |
Mpa |
2500 |
|
Fracture toughness |
Mpa.M-3/2 |
11 |
|
Elastic modulus |
Gpa |
200 |
|
Thermal expansion |
*10-6/℃ |
10.5 |
|
Thermal shock |
△T℃ |
300 |
|
Operating temperature |
℃ |
500-1000 |
|
Application |
Radiators, communication hardware,IC electronicdevices, new energy electronic equipment |
|
GRAPHITE PROCESSING CASE-Φ0.798
|
Isostatic pressing formed graphite |
||
|
P/N |
LTD-8 |
|
|
Volume density |
g/cm³ |
1.9-1.93 |
|
Electrical resistivity |
UΩM |
11-13 |
|
Thermal conductivity(100°C) |
W/M-K |
85 |
|
Thermal expansion |
*10-6/℃ |
5.85 |
|
Shore hardness |
HSD |
70 |
|
Flexural strength |
MPA |
60 |
|
Compressive strength |
MPA |
135 |
|
MOE |
GPA |
12 |
|
Air hole rate |
% |
11 |
|
Particle size |
μm |
8-10 |
|
Application |
Metallurgy, chemical industry, electric power,light industry, abrasive tools |
|
